Invention Grant
- Patent Title: Resin composition
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Application No.: US15037759Application Date: 2015-02-18
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Publication No.: US10174199B2Publication Date: 2019-01-08
- Inventor: Tomomitsu Onizawa
- Applicant: TEIJIN LIMITED
- Applicant Address: JP Osaka
- Assignee: TEIJIN LIMITED
- Current Assignee: TEIJIN LIMITED
- Current Assignee Address: JP Osaka
- Agency: Wenderoth, Lind & Ponack, L.L.P.
- Priority: JP2014-032957 20140224
- International Application: PCT/JP2015/055308 WO 20150218
- International Announcement: WO2015/125974 WO 20150827
- Main IPC: C08L81/04
- IPC: C08L81/04 ; C08L69/00

Abstract:
A resin composition which suppresses the decomposition of a polycarbonate resin at the time of molding while it retains the excellent characteristic properties of a polyarylene sulfide resin and has the excellent toughness, impact strength and burr reducing property of the polycarbonate resin.The resin composition comprises (A) 99 to 1 part by weight of a polyarylene sulfide resin (component A) having a degree of dispersion (Mw/Mn) represented by weight average molecular weight (Mw) and number average molecular weight (Mn) of not less than 2.7 and (B) 1 to 99 parts by weight of a polycarbonate resin (component B) and has a total chlorine content of not more than 550 ppm and a total sodium content of not more than 30 ppm.
Public/Granted literature
- US20160304717A1 RESIN COMPOSITION Public/Granted day:2016-10-20
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