Invention Grant
- Patent Title: Adhesive composition
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Application No.: US15579050Application Date: 2016-06-01
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Publication No.: US10174225B2Publication Date: 2019-01-08
- Inventor: Masaharu Aoki , Hidetsugu Namiki
- Applicant: DEXERIALS CORPORATION
- Applicant Address: JP Tokyo
- Assignee: DEXERIALS CORPORATION
- Current Assignee: DEXERIALS CORPORATION
- Current Assignee Address: JP Tokyo
- Agency: Oliff PLC
- Priority: JP2015-112187 20150602
- International Application: PCT/JP2016/066195 WO 20160601
- International Announcement: WO2016/194952 WO 20161208
- Main IPC: C09J181/02
- IPC: C09J181/02 ; C09J9/02 ; C08K5/17 ; H01L33/62 ; C08L81/02 ; C09J11/04 ; C09J11/06 ; C09J11/08 ; C09J133/00 ; C09J163/00 ; C09J201/02 ; C09J133/02 ; C09J133/08 ; C09J181/04

Abstract:
An adhesive composition, capable of achieving excellent life performance and a wide margin for mounting, includes a cationic polymerizable compound, an aluminum chelate/silanol-based curing catalyst, and a nucleophilic compound containing a sulfur atom having an unshared electron pair. The nucleophilic compound is a thiol compound or an episulfide compound. The aluminum chelate/silanol-based curing catalyst includes an aluminum chelate curing agent, and a silanol compound or a silane coupling agent. The aluminum chelate curing agent constitutes a latent aluminum chelate curing agent carried by a porous resin obtained through interfacial polymerization of a polyfunctional isocyanate compound.
Public/Granted literature
- US20180171184A1 ADHESIVE COMPOSITION Public/Granted day:2018-06-21
Information query
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