Invention Grant
- Patent Title: Adhesive composition and semiconductor device using same
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Application No.: US14407579Application Date: 2013-06-14
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Publication No.: US10174226B2Publication Date: 2019-01-08
- Inventor: Hideo Nakako , Toshiaki Tanaka , Michiko Natori , Dai Ishikawa , Hiroshi Matsumoto
- Applicant: HITACHI CHEMICAL COMPANY, LTD.
- Applicant Address: JP Tokyo
- Assignee: HITACHI CHEMICAL COMPANY, LTD.
- Current Assignee: HITACHI CHEMICAL COMPANY, LTD.
- Current Assignee Address: JP Tokyo
- Agency: Fitch, Even, Tabin & Flannery, LLP
- Priority: JP2012-135231 20120614
- International Application: PCT/JP2013/066516 WO 20130614
- International Announcement: WO2013/187518 WO 20131219
- Main IPC: C09J11/04
- IPC: C09J11/04 ; H01L23/495 ; C09J1/00 ; H01L23/00 ; C08K3/08 ; C09J9/02 ; H01B1/22 ; C08K7/00
Abstract:
An adhesive composition comprising silver particles containing silver atoms and zinc particles containing metallic zinc, wherein the silver atom content is 90 mass % or greater and the zinc atom content is from 0.01 mass % to 0.6 mass %, with respect to the total transition metal atoms in the solid portion of the adhesive composition.
Public/Granted literature
- US20150137347A1 ADHESIVE COMPOSITION AND SEMICONDUCTOR DEVICE USING SAME Public/Granted day:2015-05-21
Information query
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