Invention Grant
- Patent Title: Reactive hot-melt adhesive composition
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Application No.: US15323060Application Date: 2015-05-07
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Publication No.: US10174233B2Publication Date: 2019-01-08
- Inventor: Misaki Matsumura
- Applicant: The Yokohama Rubber Co., LTD.
- Applicant Address: JP
- Assignee: The Yokohama Rubber Co., LTD.
- Current Assignee: The Yokohama Rubber Co., LTD.
- Current Assignee Address: JP
- Agency: Thorpe North & Western
- Priority: JP2014-136837 20140702
- International Application: PCT/JP2015/063200 WO 20150507
- International Announcement: WO2016/002335 WO 20160107
- Main IPC: C09J175/08
- IPC: C09J175/08 ; C09J11/06 ; C09J133/00 ; C09J175/04 ; C08G18/48 ; C08G18/76 ; C08G18/78 ; C08G18/81 ; C08G18/12 ; C08L75/04 ; C08G18/67 ; C08G18/28 ; C09J175/16
Abstract:
A reactive hot-melt adhesive composition that is moisture curable contains: a urethane prepolymer having an isocyanate group, a (meth)acrylic resin, and an adhesion promoter containing at least an isocyanate group-containing (meth)acrylamide compound.
Public/Granted literature
- US20170174960A1 Reactive Hot-Melt Adhesive Composition Public/Granted day:2017-06-22
Information query
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