Provided is a thermal conductive silicone composition exhibiting no peeling of a heat dissipation grease and capable of maintaining a low thermal resistance, even under a severe condition. The thermal conductive silicone composition contains: (A) an organopolysiloxane having at least two alkenyl groups in one molecule and exhibiting a kinetic viscosity of 10 to 100,000 mm2/s at 25° C.; (B) a one-terminal-trifunctional hydrolyzable methylpolysiloxane; (C) an aluminum powder; (D) a zinc oxide powder; (E) an organohydrogenpolysiloxane; (F) an organohydrogenpolysiloxane other than the component (E); and (G) a platinum-based catalyst for hydrosilylation, wherein when a liquid obtained by mixing and dispersing the composition in toluene which is twice the amount of the composition has been sieved, a residue of not more than 5 ppm will be observed if using a 250 mesh sieve, and a residue of not less than 200 ppm will be observed if using a 440 mesh sieve.