Invention Grant
- Patent Title: Methods for forming vertically cracked thermal barrier coatings and articles including vertically cracked thermal barrier coatings
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Application No.: US15368161Application Date: 2016-12-02
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Publication No.: US10174412B2Publication Date: 2019-01-08
- Inventor: Dechao Lin , David Bucci
- Applicant: GENERAL ELECTRIC COMPANY
- Applicant Address: US NY Schnectady
- Assignee: GENERAL ELECTRIC COMPANY
- Current Assignee: GENERAL ELECTRIC COMPANY
- Current Assignee Address: US NY Schnectady
- Agency: McNees Wallace & Nurick LLC
- Main IPC: B23K1/00
- IPC: B23K1/00 ; C23C4/18 ; B23K9/04 ; B23K26/32 ; C23C24/04 ; C23C28/00 ; C23C4/11 ; B23K31/00 ; C23C4/10 ; F01D5/28 ; B23K101/00 ; B23K103/16

Abstract:
A method for forming a vertically cracked thermal barrier coating is disclosed including positioning an article relative to a heat source. The article includes a thermal barrier coating disposed on a first surface of a substrate, and the substrate includes a second surface distal across the substrate from the first surface. Heat is applied locally to at least one discrete portion of the second surface of the substrate. At least one vertical crack in the thermal barrier coating is formed disposed over the at least one discrete portion. An article is disclosed including a substrate and a vertically-cracked thermal barrier coating disposed on the substrate. The vertically cracked thermal barrier coating includes at least one vertical crack in the thermal barrier coating and at least one of a low density of less than 85% of a theoretical density for the thermal barrier coating and a selective crack distribution.
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