Invention Grant
- Patent Title: Etchant, replenishment solution and method for forming copper wiring
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Application No.: US15124018Application Date: 2016-05-31
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Publication No.: US10174428B2Publication Date: 2019-01-08
- Inventor: Hirofumi Kodera , Ikuyo Katayama , Shota Hishikawa
- Applicant: MEC COMPANY LTD.
- Applicant Address: JP Hyogo
- Assignee: MEC Company Ltd.
- Current Assignee: MEC Company Ltd.
- Current Assignee Address: JP Hyogo
- Agency: Procopio Cory Hargreaves and Savitch LLP
- Priority: JP2015-170227 20150831
- International Application: PCT/JP2016/066014 WO 20160531
- International Announcement: WO2017/038175 WO 20170309
- Main IPC: C23F1/18
- IPC: C23F1/18 ; C09K13/06 ; H05K3/06

Abstract:
An etchant for copper includes an acid and one or more compounds selected from the group consisting of an aliphatic noncyclic compound, an aliphatic heterocyclic compound and a heteroaromatic compound. The aliphatic noncyclic compound is a saturated aliphatic noncyclic compound (A) including only two or more nitrogen atoms as heteroatoms, and 2 to 10 carbon atoms. The aliphatic heterocyclic compound is a compound (B) including a five-, six-, or seven-membered ring having one or more nitrogen atoms as one or more heteroatoms constituting the ring. The heteroaromatic compound is a compound (C) including a six-membered heteroaromatic ring having one or more nitrogen atoms as one or more heteroatoms constituting the ring.
Public/Granted literature
- US20170260632A1 ETCHANT, REPLENISHMENT SOLUTION AND METHOD FOR FORMING COPPER WIRING Public/Granted day:2017-09-14
Information query
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