Invention Grant
- Patent Title: Hinge module and electronic device using the same
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Application No.: US15891323Application Date: 2018-02-07
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Publication No.: US10174535B2Publication Date: 2019-01-08
- Inventor: Che-Hsien Lin , Che-Hsien Chu
- Applicant: Che-Hsien Lin , Che-Hsien Chu
- Applicant Address: TW Taipei
- Assignee: COMPAL ELECTRONICS, INC.
- Current Assignee: COMPAL ELECTRONICS, INC.
- Current Assignee Address: TW Taipei
- Agency: JCIPRNET
- Main IPC: G06F1/16
- IPC: G06F1/16 ; E05D11/06 ; E05D11/10 ; H05K5/02 ; E05D5/04 ; E05D3/12 ; E05D3/18

Abstract:
A hinge module assembled to a first body and a second body of an electronic device and including a first rotating shaft assembled to the first body and having a first limiting portion, a second rotating shaft movably and rotatably assembled to the second body, a linking member, a switching member, and a transmission couple is provided. The second rotating shaft is fixed to the linking member and has a second limiting portion. The first rotating shaft is rotatably assembled to the linking member. The switching member movably passes through the linking member. The first limiting portion and the second limiting portion are located at two opposite ends of a moving path of the switching member to be interfered therewith. The transmission couple is respectively disposed at the second rotating shaft and the second body.
Public/Granted literature
- US20180230724A1 HINGE MODULE AND ELECTRONIC DEVICE USING THE SAME Public/Granted day:2018-08-16
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