Invention Grant
- Patent Title: Bonding assembly
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Application No.: US15074799Application Date: 2016-03-18
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Publication No.: US10174778B2Publication Date: 2019-01-08
- Inventor: Henry E. Richardson , Jeffery Thomas Shantz , Alex Mangiapane
- Applicant: Zephyros, Inc.
- Applicant Address: US MI Romeo
- Assignee: Zephyros, Inc.
- Current Assignee: Zephyros, Inc.
- Current Assignee Address: US MI Romeo
- Agency: The Dobrusin Law Firm, P.C.
- Main IPC: B62D29/00
- IPC: B62D29/00 ; B62D27/02 ; F16B17/00 ; B29C69/00
Abstract:
A device and method for the protection of a first member and second member from corrosion by utilizing a connector that bonds the members without allowing direct contact of the members.
Public/Granted literature
- US20160201708A1 BONDING ASSEMBLY Public/Granted day:2016-07-14
Information query
IPC分类:
