A method of sorting chips divided from a plate-shaped workpiece into acceptable chips and defective chips includes an ultrasonic vibration applying step of applying ultrasonic vibrations to chips, a fracture confirming step of confirming whether the chips have been fractured in the ultrasonic vibration applying step or not, and a sorting step of sorting those chips which have been confirmed as not fractured in the fracture confirming step as acceptable chips. The ultrasonic vibrations applied to the chips in the ultrasonic vibration applying step are set to values that do not cause chips to be fractured if the chips are free of minute fractures and cause chips to be fractured if the chips contain minute fractures.