Invention Grant
- Patent Title: Testing of semiconductor chips with microbumps
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Application No.: US15481891Application Date: 2017-04-07
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Publication No.: US10175294B2Publication Date: 2019-01-08
- Inventor: Wei-Cheng Wu , Hsien-Pin Hu , Shang-Yun Hou , Shin-Puu Jeng , Chen-Hua Yu , Chao-Hsiang Yang
- Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.
- Applicant Address: TW Hsin-Chu
- Assignee: Taiwan Semiconductor Manufacturing Co., Ltd.
- Current Assignee: Taiwan Semiconductor Manufacturing Co., Ltd.
- Current Assignee Address: TW Hsin-Chu
- Agency: Eschweiler & Potashnik, LLC
- Main IPC: G01R31/26
- IPC: G01R31/26 ; G01R31/28 ; H01L21/66 ; H01L23/00 ; G01R1/04
Abstract:
A device includes a test pad on a chip. A first microbump has a first surface area that is less than a surface area of the test pad. A first conductive path couples the test pad to the first microbump. A second microbump has a second surface area that is less than the surface area of the test pad. A second conductive path couples the test pad to the second microbump.
Public/Granted literature
- US20170212167A1 TESTING OF SEMICONDUCTOR CHIPS WITH MICROBUMPS Public/Granted day:2017-07-27
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