Invention Grant
- Patent Title: Ultra-high density patch systems
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Application No.: US15816906Application Date: 2017-11-17
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Publication No.: US10175441B2Publication Date: 2019-01-08
- Inventor: Steven W. Ellison , David Knaggs
- Applicant: Telect, Inc.
- Applicant Address: US WA Liberty Lake
- Assignee: Telect, Inc.
- Current Assignee: Telect, Inc.
- Current Assignee Address: US WA Liberty Lake
- Agency: Lee & Hayes, PLLC
- Main IPC: G02B6/00
- IPC: G02B6/00 ; G02B6/44

Abstract:
A plurality of patch trays displaceably received in a chassis received in a left side or right side of an access side of a frame, and a splice tray removeably received in the access side of the frame. The splice tray having a capacity to receive at least about 288 fiber terminations and the plurality of patch trays displaceably received in the chassis having a capacity to collectively receive the at least about 288 fiber terminations from the splice tray. A patch tray including a row of pop-up adapter packs to collectively receive a respective portion of the at least about 288 fiber terminations received by the patch tray. The row of pop-up adapter packs arranged in the patch tray substantially in a left side or right side of the patch tray to offset the row of pop-up adapter packs to provide more space for routing the respective portion of the 288 fiber terminations in the patch tray.
Public/Granted literature
- US20180074276A1 Ultra-High Density Patch Systems Public/Granted day:2018-03-15
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