Invention Grant
- Patent Title: Electronic component
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Application No.: US13743221Application Date: 2013-01-16
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Publication No.: US10176916B2Publication Date: 2019-01-08
- Inventor: Atsushi Seko , Katsuhiro Misaki
- Applicant: MURATA MANUFACTURING CO., LTD.
- Applicant Address: JP Kyoto-fu
- Assignee: Murata Manufacturing Co., Ltd.
- Current Assignee: Murata Manufacturing Co., Ltd.
- Current Assignee Address: JP Kyoto-fu
- Agency: Studebaker & Brackett PC
- Priority: JP2012-012103 20120124
- Main IPC: H01F5/00
- IPC: H01F5/00 ; H01F27/28 ; H01F27/29 ; H01F17/00

Abstract:
A multilayer body is formed of a plurality of insulator layers that are stacked on top of one another. A coil is a helical coil provided in the multilayer body and includes a plurality of coil conductor layers that are superposed with one another so as to form a ring-shaped path when seen in plan view from a stacking direction and a plurality of via hole conductors that connect the plurality of coil conductor layers together. The path includes corners that project outward and corners that project inward. Each of the via hole conductors are provided at one of the corners, which project outward.
Public/Granted literature
- US20130187744A1 ELECTRONIC COMPONENT Public/Granted day:2013-07-25
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