Invention Grant
- Patent Title: Method of cooling a composition using a hall effect enhanced capacitively coupled plasma source, an abatement system, and vacuum processing system
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Application No.: US15411711Application Date: 2017-01-20
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Publication No.: US10176973B2Publication Date: 2019-01-08
- Inventor: Michael S. Cox , Rongping Wang , Brian T. West , Roger M. Johnson , Colin John Dickinson
- Applicant: Applied Materials, Inc.
- Applicant Address: US CA Santa Clara
- Assignee: APPLIED MATERIALS, INC.
- Current Assignee: APPLIED MATERIALS, INC.
- Current Assignee Address: US CA Santa Clara
- Agency: Patterson + Sheridan LLP
- Main IPC: B01D53/64
- IPC: B01D53/64 ; B01D53/68 ; H01J37/32 ; B01D53/32 ; H01L21/02
Abstract:
Embodiments disclosed herein include a method for abating compounds produced in semiconductor processes. The method includes energizing an abating agent, forming a composition by reacting the energized abating agent with gases exiting a vacuum processing chamber, and flowing the composition through a plurality of holes formed in a cooling plate. By cooling the composition with the cooling plate, damages on the downstream pump are avoided.
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