A method includes providing a semiconductor structure having a substrate and a plurality of fins extending upwards from the substrate. A CT pillar layer is disposed over the semiconductor structure. A CT mask is lithographically patterned over the CT pillar layer. The CT mask is anisotropically etched to remove exposed portions of the CT pillar layer and to form a CT pillar between the fins. A dummy gate structure is disposed across the CT pillar. The dummy gate structure is replaced with first and second metal gate structures that are electrically isolated from each other by the CT pillar.