Invention Grant
- Patent Title: Semiconductor device and method of manufacturing thereof
-
Application No.: US15469008Application Date: 2017-03-24
-
Publication No.: US10177095B2Publication Date: 2019-01-08
- Inventor: Yi Seul Han , Tae Yong Lee , Ji Yeon Ryu
- Applicant: Amkor Technology, Inc.
- Applicant Address: US AZ Tempe
- Assignee: Amkor Technology, Inc.
- Current Assignee: Amkor Technology, Inc.
- Current Assignee Address: US AZ Tempe
- Agency: McAndrews, Held & Malloy, Ltd.
- Main IPC: H01L23/552
- IPC: H01L23/552 ; H01L23/00 ; H01L21/56 ; H01L23/31
Abstract:
A semiconductor device and a method of manufacturing a semiconductor device. As a non-limiting example, various aspects of this disclosure provide a semiconductor device comprising one or more conductive shielding members and an EMI shielding layer, and a method of manufacturing thereof.
Public/Granted literature
- US20180277489A1 SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THEREOF Public/Granted day:2018-09-27
Information query
IPC分类:
