Invention Grant
- Patent Title: C-plane GaN substrate
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Application No.: US15681971Application Date: 2017-08-21
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Publication No.: US10177217B2Publication Date: 2019-01-08
- Inventor: Kenji Iso , Hiromitsu Kimura , Yuya Saito , Yuuki Enatsu
- Applicant: MITSUBISHI CHEMICAL CORPORATION
- Applicant Address: JP Tokyo
- Assignee: MITSUBISHI CHEMICAL CORPORATION
- Current Assignee: MITSUBISHI CHEMICAL CORPORATION
- Current Assignee Address: JP Tokyo
- Agency: Leason Ellis LLP
- Priority: JP2015-032948 20150223
- Main IPC: H01L29/04
- IPC: H01L29/04 ; C30B25/04 ; C23C16/34 ; H01L21/02 ; H01L29/06 ; C30B29/40

Abstract:
A C-plane GaN substrate only mildly restricts the shape and dimension of a nitride semiconductor device formed on the substrate. The variation of an off-angle on the main surface of the substrate is suppressed. In the C-plane GaN substrate: the substrate comprises a plurality of facet growth areas each having a closed ring outline-shape on the main surface; the number density of the facet growth area accompanied by a core among the plurality of facet growth areas is less than 5 cm−2 on the main surface; and, when any circular area of 4 cm diameter is selected from an area which is on the main surface and is distant by 5 mm or more from the outer peripheral edge of the substrate, the variation widths of an a-axis direction component and an m-axis direction component of an off-angle within the circular area is each 0.25 degrees or less.
Public/Granted literature
- US20170352721A1 C-PLANE GaN SUBSTRATE Public/Granted day:2017-12-07
Information query
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