Invention Grant
- Patent Title: Semiconductor device and method of manufacturing semiconductor device
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Application No.: US15637194Application Date: 2017-06-29
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Publication No.: US10177219B2Publication Date: 2019-01-08
- Inventor: Shuhei Tatemichi , Shunji Takenoiri
- Applicant: FUJI ELECTRIC CO., LTD.
- Applicant Address: JP Kawasaki-Shi, Kanagawa
- Assignee: FUJI ELECTRIC CO., LTD.
- Current Assignee: FUJI ELECTRIC CO., LTD.
- Current Assignee Address: JP Kawasaki-Shi, Kanagawa
- Agency: Rabin & Berdo, P.C.
- Priority: JP2016-163158 20160823
- Main IPC: H01L29/06
- IPC: H01L29/06 ; H01L21/265

Abstract:
A semiconductor device, including a semiconductor layer of a first conductivity type, and a parallel pn layer formed on a surface of the semiconductor layer. The parallel pn layer includes a plurality of first semiconductor regions of the first conductivity type, and a plurality of second semiconductor regions of a second conductivity type. The first and second semiconductor regions are alternatingly arranged in a direction parallel to the surface of the semiconductor layer. Each second semiconductor region has at least one first region that is a region having a group 18 element introduced therein.
Public/Granted literature
- US20180061936A1 SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE Public/Granted day:2018-03-01
Information query
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