An earphone including a housing, a speaker and an eartip is provided. The housing has an accommodating space and a first sound outlet communicated with each other. The speaker is disposed in the accommodating space. The eartip is assembled to the housing. The eartip has a second sound outlet and an incline extension surface. The incline extension surface is configured to fit into a cavum of a user's auricle and withstand an antihelix of the user's auricle.