Invention Grant
- Patent Title: Compliant constrained headband spring
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Application No.: US15692918Application Date: 2017-08-31
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Publication No.: US10178476B2Publication Date: 2019-01-08
- Inventor: Eric M. Wallace , Michael J. Monahan , Derek James Butland
- Applicant: BOSE CORPORATION
- Applicant Address: US MA Framingham
- Assignee: BOSE CORPORATION
- Current Assignee: BOSE CORPORATION
- Current Assignee Address: US MA Framingham
- Agency: Lando & Anastasi, LLP
- Main IPC: H04R5/033
- IPC: H04R5/033 ; H04R1/10 ; F16F1/18

Abstract:
A compliant constrained headband spring for audio headphones includes a headband spring element and a stiffness enhancing element coupled to the headband spring element. The compliant constrained headband spring exhibits a first stiffness in an open position and a second stiffness greater than the first stiffness when closed beyond a predetermined point.
Public/Granted literature
- US20170366892A1 COMPLIANT CONSTRAINED HEADBAND SPRING Public/Granted day:2017-12-21
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