Invention Grant
- Patent Title: Vibrating diaphragm assembly
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Application No.: US15540202Application Date: 2015-11-13
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Publication No.: US10178477B2Publication Date: 2019-01-08
- Inventor: Hairong Wang , Lianwen Shan , Xinfeng Yang
- Applicant: Goertek.Inc
- Applicant Address: CN Weifang, Shandong
- Assignee: Goertek Inc.
- Current Assignee: Goertek Inc.
- Current Assignee Address: CN Weifang, Shandong
- Agency: Alston & Bird LLP
- Priority: CN201510131459 20150324
- International Application: PCT/CN2015/094516 WO 20151113
- International Announcement: WO2016/150173 WO 20160929
- Main IPC: H04R7/06
- IPC: H04R7/06 ; B29C45/14 ; G10K13/00 ; H04R7/12 ; H04R7/16 ; H04R9/06 ; H04R7/10 ; B32B15/088 ; B29C45/16 ; B29L31/38

Abstract:
A vibrating diaphragm assembly related to the technical field of electroacoustic products is provided. The vibrating diaphragm assembly comprises a vibrating diaphragm, wherein the vibrating diaphragm comprises a middle part and a folding ring part surrounding the periphery of the middle part. The vibrating diaphragm also comprises a vibrating diaphragm substrate layer and a silica gel layer; the silica gel layer being at least partially combined with the vibrating diaphragm substrate layer. The vibrating diaphragm substrate layer is also a high molecular material layer; the silica gel layer is combined on the surface of the folding ring part; and the silica gel layer and the high molecular material layer are formed through injection molding.
Public/Granted literature
- US20170374468A1 VIBRATING DIAPHRAGM ASSEMBLY Public/Granted day:2017-12-28
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