Invention Grant
- Patent Title: Printed wiring board and method of producing the same
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Application No.: US14951606Application Date: 2015-11-25
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Publication No.: US10178758B2Publication Date: 2019-01-08
- Inventor: Yoshitaka Toyota , Kengo Iokibe , Yuki Yamashita , Toshiyuki Kaneko , Masanori Naito , Kiyohiko Kaiya , Toshihisa Uehara , Koichi Kondo
- Applicant: National University Corporation Okayama University , KYOCERA Circuit Solutions, Inc.
- Applicant Address: JP Kyoto JP Kyoto-shi, Kyoto
- Assignee: NATIONAL UNIVERSITY CORPORATION OKAYAMA UNIVERSITY,KYOCERA CORPORATION
- Current Assignee: NATIONAL UNIVERSITY CORPORATION OKAYAMA UNIVERSITY,KYOCERA CORPORATION
- Current Assignee Address: JP Kyoto JP Kyoto-shi, Kyoto
- Agency: Volpe and Koenig, P.C.
- Priority: JP2014-242125 20141128; JP2015-039026 20150227
- Main IPC: H05K1/02
- IPC: H05K1/02
Abstract:
A printed wiring board includes a digital circuit, an analog circuit, and a power supply path that is disposed on an insulating layer between the digital circuit and the analog circuit. A plurality of open stub EBG structures are disposed at an end of a bridge section in a power supply plane. The open stub EBG structure is an open stub state whose one end is connected to the power supply path and other end is in an open state.
Public/Granted literature
- US20160157338A1 PRINTED WIRING BOARD AND METHOD OF PRODUCING THE SAME Public/Granted day:2016-06-02
Information query
