Invention Grant
- Patent Title: Copper foil provided with carrier, laminate, printed wiring board, and method for fabricating printed wiring board
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Application No.: US15002060Application Date: 2016-01-20
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Publication No.: US10178775B2Publication Date: 2019-01-08
- Inventor: Yoshiyuki Miyoshi , Michiya Kohiki , Masafumi Ishii
- Applicant: JX NIPPON MINING & METALS CORPORATION
- Applicant Address: JP Tokyo
- Assignee: JX Nippon Mining & Metals Corporation
- Current Assignee: JX Nippon Mining & Metals Corporation
- Current Assignee Address: JP Tokyo
- Agency: Drinker Biddle & Reath LLP
- Priority: JP2015-009884 20150121
- Main IPC: H05K3/02
- IPC: H05K3/02 ; H05K1/09 ; C25D5/10 ; C25D7/06 ; H05K3/20 ; H05K3/40 ; H05K3/42 ; C25D1/04 ; C25D3/38 ; C25D5/02

Abstract:
Provided is a copper foil provided with a carrier which enables, in a laminate produced by laminating a copper foil provided with a carrier on a resin substrate, to peel the ultrathin copper layer from the carrier well. A copper foil provided with a carrier having, in order, a carrier, an intermediate layer, and an ultrathin copper layer, wherein, when the surface of the carrier opposite to the ultrathin copper layer is measured using a laser microscope based on JIS B0601-1994, the ten point average roughness Rz of the surface is 6.0 μm or less.
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