Invention Grant
- Patent Title: Module-type data center
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Application No.: US14501738Application Date: 2014-09-30
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Publication No.: US10178809B2Publication Date: 2019-01-08
- Inventor: Hiroshi Endo , Masao Kondo , Hiroyuki Fukuda , Masatoshi Ogawa
- Applicant: FUJITSU LIMTED
- Applicant Address: JP Kawasaki
- Assignee: FUJITSU LIMITED
- Current Assignee: FUJITSU LIMITED
- Current Assignee Address: JP Kawasaki
- Agency: Kratz, Quintos & Hanson, LLP
- Main IPC: F24F1/00
- IPC: F24F1/00 ; G06F1/20 ; H05K7/14 ; H05K7/20

Abstract:
A module-type data center includes: a casing having an intake vent and an exhaust vent; a rack accommodating an electronic device; an air blower configured to introduce outside air into the casing through the intake vent and pass air through the rack from one of surfaces of the rack to another one of the surfaces of the rack; a shielding-slat unit including a plurality of shielding slats configured to change between an open state and a closed state and drive devices configured to drive the corresponding shielding slats. An inner space of the casing is divided into a first space defined between the one surface of the rack and the intake vent, a second space defined between the other surface of the rack and the exhaust vent, and a third space defined above the rack and allowing the second space to communicate with the first space.
Public/Granted literature
- US20150016056A1 MODULE-TYPE DATA CENTER Public/Granted day:2015-01-15
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