Invention Grant
- Patent Title: Multilayer capacitor and board having the same mounted thereon
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Application No.: US15645601Application Date: 2017-07-10
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Publication No.: US10192685B2Publication Date: 2019-01-29
- Inventor: Heung Kil Park , Jong Hwan Park , Se Hun Park , Young Ghyu Ahn
- Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Applicant Address: KR Suwon-si, Gyeonggi-do
- Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Current Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Current Assignee Address: KR Suwon-si, Gyeonggi-do
- Agency: McDermott Will & Emery LLP
- Priority: KR10-2016-0156573 20161123
- Main IPC: H01G4/30
- IPC: H01G4/30 ; H01G4/228 ; H01G4/005 ; H05K1/18 ; H05K3/34

Abstract:
A multilayer capacitor includes a capacitor body including a plurality of first and second internal electrodes alternately disposed therein and a dielectric layer interposed therebetween, and having first to sixth surfaces, opposing each other, respectively; a plurality of external electrodes connected to the first and second internal electrodes; an insulating layer disposed on the first surface; first and second terminal electrodes spaced apart from each other in a direction in which the third and fourth surfaces are connected, on the insulating layer; and a connecting member electrically connecting the first and second terminal electrodes and the external electrodes.
Public/Granted literature
- US20180144868A1 MULTILAYER CAPACITOR AND BOARD HAVING THE SAME MOUNTED THEREON Public/Granted day:2018-05-24
Information query