Invention Grant
- Patent Title: Polymer layer on metal core for plurality of bumps connected to conductive pads
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Application No.: US15659547Application Date: 2017-07-25
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Publication No.: US10192812B2Publication Date: 2019-01-29
- Inventor: Byoung Yong Kim , Jeong Ho Hwang
- Applicant: Samsung Display Co., Ltd.
- Applicant Address: KR Yongin-si
- Assignee: Samsung Display Co., Ltd.
- Current Assignee: Samsung Display Co., Ltd.
- Current Assignee Address: KR Yongin-si
- Agency: H.C. Park & Associates, PLC
- Priority: KR10-2016-0107764 20160824
- Main IPC: H01L23/48
- IPC: H01L23/48 ; H01L21/44 ; B23K31/02 ; H01L23/498 ; H01L23/00 ; H01L23/532 ; H01L23/31
Abstract:
A semiconductor chip, a display device or an electronic device includes a substrate, one or more conductive pads disposed on the substrate, and one or more bumps electrically connected to the one or more conductive pads, in which the one or more bumps includes a metal core, a polymer layer disposed over a surface of the metal core, and a conductive coating layer disposed over a surface of the polymer layer and electrically connected to the one or more conductive pads.
Public/Granted literature
- US20180061748A1 SEMICONDUCTOR CHIP, DISPLAY PANEL, AND ELECTRONIC DEVICE Public/Granted day:2018-03-01
Information query
IPC分类:
