Invention Grant
- Patent Title: Semiconductor device and method of manufacturing the same
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Application No.: US15229518Application Date: 2016-08-05
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Publication No.: US10192823B2Publication Date: 2019-01-29
- Inventor: Jihoon Yoon , Shincheol Min , Hyun-Min Choi
- Applicant: Samsung Electronics Co., Ltd.
- Applicant Address: KR
- Assignee: Samsung Electronics Co., Ltd.
- Current Assignee: Samsung Electronics Co., Ltd.
- Current Assignee Address: KR
- Agency: Onello & Mello, LLP
- Priority: KR10-2015-0127135 20150908
- Main IPC: H01L23/62
- IPC: H01L23/62 ; H01L23/525 ; H01L27/112 ; H01L21/66 ; H01L27/11582

Abstract:
In a semiconductor device and a method of manufacturing the same a fuse structure may be formed during formation of first to third contact plugs connected to a transistor. The fuse structure may include first and second fuse contact plugs having the same height as the first and second contact plugs, and a connection pattern having the same height as the third contact plug. The connection pattern may be connected between the first and second fuse contact plugs.
Public/Granted literature
- US20170069570A1 SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME Public/Granted day:2017-03-09
Information query
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