Invention Grant
- Patent Title: Butted body contact for SOI transistor
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Application No.: US15824932Application Date: 2017-11-28
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Publication No.: US10192884B2Publication Date: 2019-01-29
- Inventor: Simon Edward Willard
- Applicant: pSemi Corporation
- Applicant Address: US CA San Diego
- Assignee: pSemi Corporation
- Current Assignee: pSemi Corporation
- Current Assignee Address: US CA San Diego
- Agency: Jaquez Land Greenhaus LLP
- Agent Martin J. Jaquez; Alessandro Steinfl, Esq.
- Main IPC: H01L27/12
- IPC: H01L27/12 ; H01L29/49 ; H01L27/02 ; H03F3/195 ; H03F3/217 ; H03F3/213 ; H01L29/06 ; H01L29/08 ; H01L29/10 ; H01L29/423 ; H01L29/786

Abstract:
Systems, methods, and apparatus for an improved body tie construction are described. The improved body tie construction is configured to have a lower resistance body tie exists when the transistor is “off” (Vg approximately 0 volts). When the transistor is “on” (Vg>Vt), the resistance to the body tie is much higher, reducing the loss of performance associated with presence of body tie. Space efficient Body tie constructions adapted for cascode configurations are also described.
Public/Granted literature
- US20180211973A1 Butted Body Contact for SOI Transistor Public/Granted day:2018-07-26
Information query
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