Invention Grant
- Patent Title: Capillary alignment jig for wire bonder
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Application No.: US15005172Application Date: 2016-01-25
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Publication No.: US10195685B2Publication Date: 2019-02-05
- Inventor: Elmer Rad Bais Tabio , Pablo E. Remogat, Jr. , Rolando B. Zarraga, Jr. , Armando U. Carrera, II
- Applicant: Texas Instruments Incorporated
- Applicant Address: US TX Dallas
- Assignee: TEXAS INSTRUMENTS INCORPORATED
- Current Assignee: TEXAS INSTRUMENTS INCORPORATED
- Current Assignee Address: US TX Dallas
- Agent Ronald O. Neerings; Charles A. Brill; Frank D. Cimino
- Main IPC: B23K20/00
- IPC: B23K20/00 ; B23P6/00 ; H01L23/00
Abstract:
A capillary alignment tool for installing a new capillary in the transducer on a wire bonding machine. A capillary alignment tool for installing a new capillary in a transducer on wire bonding machine. A method for installing a new capillary in the transducer of a wire bonding machine using the capillary alignment tool.
Public/Granted literature
- US20170209955A1 CAPILLARY ALIGNMENT JIG FOR WIRE BONDER Public/Granted day:2017-07-27
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