Invention Grant
- Patent Title: Lift pin for substrate processing
-
Application No.: US13833616Application Date: 2013-03-15
-
Publication No.: US10195704B2Publication Date: 2019-02-05
- Inventor: Christian Himmelsbach , Joachim Hirschler , Helmut Brunner
- Applicant: Infineon Technologies AG
- Applicant Address: DE Neubiberg
- Assignee: Infineon Technologies AG
- Current Assignee: Infineon Technologies AG
- Current Assignee Address: DE Neubiberg
- Agency: Slater Matsil, LLP
- Main IPC: B23Q7/00
- IPC: B23Q7/00 ; H01L21/687
Abstract:
Lift pins and devices having lift pins are provided. According to an aspect, a lift pin may have a tapered distal portion. According to another aspect, a lift pin may have two portions threadedly engaged with each other. According to yet another aspect, a lift pin may be mounted to a lifting plate with slackness.
Public/Granted literature
- US20140265098A1 Lift Pin for Substrate Processing Public/Granted day:2014-09-18
Information query
