- Patent Title: Chemical mechanical polishing machine and polishing head assembly
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Application No.: US14988367Application Date: 2016-01-05
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Publication No.: US10195715B2Publication Date: 2019-02-05
- Inventor: In-Kwon Kim , Kyung-Hyun Kim , Ki-Jong Park , Ki-Ho Bae , Jong-Heun Lim
- Applicant: SAMSUNG ELECTRONICS CO., LTD.
- Applicant Address: KR Suwon-si, Gyeonggi-Do
- Assignee: SAMSUNG ELECTRONICS CO., LTD.
- Current Assignee: SAMSUNG ELECTRONICS CO., LTD.
- Current Assignee Address: KR Suwon-si, Gyeonggi-Do
- Agency: F. Chau & Associates, LLC.
- Priority: KR10-2013-0017488 20130219
- Main IPC: B24B37/30
- IPC: B24B37/30 ; B24B37/10 ; B24B37/04 ; B24B37/32
Abstract:
A chemical mechanical polishing machine includes a polishing head assembly including a polishing head body and a membrane disposed at a bottom of the polishing head body. The bottom surface of the membrane includes a hydrophobic area and a hydrophilic area.
Public/Granted literature
- US20160129549A1 CHEMICAL MECHANICAL POLISHING MACHINE AND POLISHING HEAD ASSEMBLY Public/Granted day:2016-05-12
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