Invention Grant
- Patent Title: Gypsum board manufacturing method and manufacturing device
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Application No.: US14779178Application Date: 2014-03-24
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Publication No.: US10195765B2Publication Date: 2019-02-05
- Inventor: Tsuyoshi Yoshida , Akira Himeno , Tomohiro Noguchi
- Applicant: YOSHINO GYPSUM CO., LTD.
- Applicant Address: JP Tokyo
- Assignee: YOSHINO GYPSUM CO., LTD.
- Current Assignee: YOSHINO GYPSUM CO., LTD.
- Current Assignee Address: JP Tokyo
- Agency: Hamre, Schumann, Mueller & Larson, P.C.
- Priority: JP2013-108116 20130522
- International Application: PCT/JP2014/057964 WO 20140324
- International Announcement: WO2014/188772 WO 20141127
- Main IPC: B28B19/00
- IPC: B28B19/00 ; B28B7/00 ; B28B17/00

Abstract:
As a lower forming plate 8, a forming plate having: a lower plate main body 10 constituted from an electrically conductive material; and a lower embedded electrode 12 embedded in the lower plate main body 10, the lower embedded electrode 12 being electrically insulated from the lower plate main body 10 by an insulator 14 and being embedded so as for a portion thereof to be exposed on the surface of the lower plate main body 10 making contact with a lower lining paper sheet 16 is used.
Public/Granted literature
- US20160052167A1 GYPSUM BOARD MANUFACTURING METHOD AND MANUFACTURING DEVICE Public/Granted day:2016-02-25
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