Invention Grant
- Patent Title: Resin composition, forming resin composition prepared by using the same, laminate, and laminate producing method
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Application No.: US12677861Application Date: 2008-09-24
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Publication No.: US10196505B2Publication Date: 2019-02-05
- Inventor: Kenji Ninomiya , Kaname Kida , Yoshitaka Matsumura
- Applicant: Kenji Ninomiya , Kaname Kida , Yoshitaka Matsumura
- Applicant Address: JP Osaka
- Assignee: THE NIPPON SYNTHETIC CHEMICAL INDUSTRY CO., LTD.
- Current Assignee: THE NIPPON SYNTHETIC CHEMICAL INDUSTRY CO., LTD.
- Current Assignee Address: JP Osaka
- Agency: Greenblum & Bernstein, P.L.C.
- Priority: JP2007-247908 20070925
- International Application: PCT/JP2008/067194 WO 20080924
- International Announcement: WO2009/041440 WO 20090402
- Main IPC: C08L23/10
- IPC: C08L23/10 ; C08L23/08 ; C08L29/04 ; C08L31/04 ; C08K3/34 ; C08K13/02 ; C08L51/06 ; C08K5/098

Abstract:
A resin composition is provided, which comprises: an ethylene-vinyl acetate copolymer (A); and a saponified ethylene-vinyl acetate copolymer (B) having an ethylene content of not less than 70 mol %, wherein the component (B) is present in a proportion of 1 to 30 parts by weight based on 100 parts by weight of the component (A). Where the resin composition is used in combination with a scrap laminate including a polyolefin resin layer and an EVOH layer for recycling the scrap laminate, die build-up is suppressed, and a product formed from the resulting recycled material is excellent in appearance and substantially free from coloration.
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