Invention Grant
- Patent Title: Lid and method for sealing a non-magnetic package
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Application No.: US14529410Application Date: 2014-10-31
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Publication No.: US10196745B2Publication Date: 2019-02-05
- Inventor: Christopher Kapusta , Marco Francesco Aimi
- Applicant: General Electric Company
- Applicant Address: US NY Schenectady
- Assignee: General Electric Company
- Current Assignee: General Electric Company
- Current Assignee Address: US NY Schenectady
- Agency: Ziolkowski Patent Solutions Group, SC
- Agent Jean K. Testa
- Main IPC: B23K101/00
- IPC: B23K101/00 ; B23K101/36 ; B23K37/00 ; C23C28/02 ; B81C1/00
Abstract:
A non-magnetic lid for sealing a hermetic package. The lid includes a molybdenum substrate having a sputtered adhesion layer and a copper seed layer. The lid also includes a plated palladium solder base layer, and has a gold/tin solder preform attached to a sealing surface of the lid.
Public/Granted literature
- US20160122183A1 LID AND METHOD FOR SEALING A NON-MAGNETIC PACKAGE Public/Granted day:2016-05-05
Information query
