Invention Grant
- Patent Title: Encapsulated splice chuck
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Application No.: US15648127Application Date: 2017-07-12
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Publication No.: US10196820B2Publication Date: 2019-02-05
- Inventor: Felix Sorkin
- Applicant: Felix Sorkin
- Agency: Adolph Locklar
- Main IPC: E04C5/08
- IPC: E04C5/08 ; E04C5/16 ; E04C5/12 ; E04G21/12

Abstract:
An encapsulated splice chuck may include a splice chuck body and a body encapsulation positioned about an exterior surface of the splice chuck body. The encapsulated splice chuck may also include a first forcing cone threadedly coupled to the splice chuck body, the first forcing cone including a tapered inner surface. In addition, the encapsulated splice chuck may include a first forcing cone encapsulation positioned about an exterior surface of the first forcing cone and a first set of wedges positioned within the first forcing cone. The encapsulated splice chuck may include a second forcing cone mechanically coupled to the splice chuck body, the second forcing cone including a tapered inner surface, and a second forcing cone encapsulation positioned about an exterior surface of the second forcing cone. The encapsulated splice chuck may also include a second set of wedges positioned within the second forcing cone.
Public/Granted literature
- US20180016789A1 ENCAPSULATED SPLICE CHUCK Public/Granted day:2018-01-18
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