Invention Grant
- Patent Title: Foam substructure for a heat exchanger
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Application No.: US15398605Application Date: 2017-01-04
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Publication No.: US10197294B2Publication Date: 2019-02-05
- Inventor: Robert L. Eskew , Frank D. Ashby , Jeremiah M. Horn , Cody J. Kaiser
- Applicant: Johnson Controls Technology Company
- Applicant Address: US MI Auburn Hills
- Assignee: Johnson Controls Technology Company
- Current Assignee: Johnson Controls Technology Company
- Current Assignee Address: US MI Auburn Hills
- Agency: Fletcher Yoder, P.C.
- Main IPC: F24F1/56
- IPC: F24F1/56 ; F24F1/16 ; F24F1/50
Abstract:
A heat exchanger system includes a heat exchanger coil, a base of a foam structure including a clamp with a first arm and a second arm, where the first arm and the second arm are configured to exert a clamping force against the heat exchanger coil, and a vertical member of the foam substructure coupled to the base and abutting a cover of the heat exchanger system, where the base and the vertical member are configured to block air flowing through the heat exchanger from flowing into a void between the heat exchanger coil and the cover.
Public/Granted literature
- US20170205084A1 FOAM SUBSTRUCTURE FOR A HEAT EXCHANGER Public/Granted day:2017-07-20
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