Invention Grant
- Patent Title: Cold end heat exchanging device and semiconductor refrigerator
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Application No.: US15536512Application Date: 2015-09-28
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Publication No.: US10197309B2Publication Date: 2019-02-05
- Inventor: Haibo Tao , Dong Yu , Peng Li , Jianru Liu , Dingyuan Wang , Chunyang Li , Feifei Qi , Lisheng Ji
- Applicant: Qingdao Haier Joint Stock Co., Ltd.
- Applicant Address: CN Qingdao
- Assignee: QINGDAO HAIER JOINT STOCK CO., LTD
- Current Assignee: QINGDAO HAIER JOINT STOCK CO., LTD
- Current Assignee Address: CN Qingdao
- Agency: Alston & Bird LLP
- Priority: CN201410777708 20141215
- International Application: PCT/CN2015/090985 WO 20150928
- International Announcement: WO2016/095587 WO 20160623
- Main IPC: F25B21/02
- IPC: F25B21/02 ; F25D19/00 ; F25D11/00 ; F25D16/00 ; F25D17/02

Abstract:
A cold end heat exchanging device and a semiconductor refrigerator having the cold end heat exchanging device. The cold end heat exchanging device comprises a cold end heat exchanging part and a plurality of refrigerant pipelines. The cold end heat exchanging part defines an inner cavity or a conduit for containing a gas-phase and liquid-phase co-existing refrigerant. Each refrigerant pipeline is provided with an evaporation section that is downwards bent and extends in a vertical plane and has a closed tail end, and a connection section that is upwards bent and extends from a starting end of the evaporation section and is connected to the inner cavity or the conduit. Evaporation sections of at least some refrigerant pipelines of the plurality of refrigerant pipelines are distributed in two vertical planes that are perpendicular to each other.
Public/Granted literature
- US20170328611A1 COLD END HEAT EXCHANGING DEVICE AND SEMICONDUCTOR REFRIGERATOR Public/Granted day:2017-11-16
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