A deformation sensing apparatus comprises an elastic substrate, a conductive element, and an additional conductive element. The conductive element includes conductive joints that are separated from each other by resolving elements along a length of the conductive element. Different combinations of conductive joints and resolving elements correspond to different segments of the deformation sensing apparatus. Based on a change in capacitance between a conductive joint and the additional conductive element when a strain is applied to the deformation sensing apparatus, the deformation sensing apparatus generates a signal that allows determination of how the strain deforms the deformation sensing apparatus.