Provided is a cutting device that prevents a variation of shocks or impacts applied to a substrate during a cutting operation. The cutting device includes a pressing part; a cutting part disposed so as to move with respect to the pressing part so as to contact the substrate on an opposite side of the pressing part to thereby sandwich the substrate between the cutting part and the pressing part to shear the substrate; a first force generation part for generating pressing force to press the pressing part against the substrate; and a first adjustment part for adjusting the pressing force in response to the force applied from the substrate to the pressing part when the pressing part presses the substrate with the first force generation part.