Invention Grant
- Patent Title: Thin film heating systems for air data probes
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Application No.: US15347670Application Date: 2016-11-09
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Publication No.: US10197588B2Publication Date: 2019-02-05
- Inventor: Yates Wong , Grant A. Gordon , Nicholas A Everson , Morris G. Anderson
- Applicant: Honeywell International Inc.
- Applicant Address: US NJ Morris Plains
- Assignee: Honeywell International Inc.
- Current Assignee: Honeywell International Inc.
- Current Assignee Address: US NJ Morris Plains
- Agency: Fogg & Powers
- Main IPC: G01P5/165
- IPC: G01P5/165 ; G01F1/46 ; G01K13/02 ; G01P13/02 ; H05B3/34

Abstract:
An air data probe is provided. The air data probe comprises an inner body having an outer surface, an outer body having an inner surface, a thin film heating system having a first surface and a second surface, a first thermally conductive adhesive disposed between the first surface and the outer surface, a second thermally conductive adhesive disposed between the second surface and the inner surface; and wherein the thin film heating system comprises one or more thin film heaters having one or more heating elements disposed in a thermally conductive, electrical insulator.
Public/Granted literature
- US20180128849A1 APPARATUS AND METHOD FOR THIN FILM HEATING SYSTEMS FOR AIR DATA PROBES Public/Granted day:2018-05-10
Information query
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