Invention Grant
- Patent Title: Photosensitive resin composition and cured product thereof
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Application No.: US15516116Application Date: 2015-09-29
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Publication No.: US10197913B2Publication Date: 2019-02-05
- Inventor: Koji Arimitsu , Kiwamu Terada
- Applicant: Tokyo University of Science Foundation , NIPPON KAYAKU KABUSHIKI KAISHA
- Applicant Address: JP Tokyo JP Tokyo
- Assignee: TOKYO UNIVERSITY OF SCIENCE FOUNDATION,NIPPON KAYAKU KABUSHIKI KAISHA
- Current Assignee: TOKYO UNIVERSITY OF SCIENCE FOUNDATION,NIPPON KAYAKU KABUSHIKI KAISHA
- Current Assignee Address: JP Tokyo JP Tokyo
- Agency: Greenblum & Bernstein, P.L.C.
- Priority: JP2014-202947 20141001
- International Application: PCT/JP2015/077485 WO 20150929
- International Announcement: WO2016/052493 WO 20160407
- Main IPC: G03F7/16
- IPC: G03F7/16 ; G06F7/20 ; G03F7/32 ; G03F7/38 ; G03F7/004 ; G03F7/038 ; G03F7/20
Abstract:
Provided is a photosensitive resin composition that contains (A) a photobase generator and (B) an alkali-soluble epoxy compound, wherein the photobase generator (A) contains a compound represented by formula (2-1): and the alkali-soluble epoxy compound (B) is an epoxy compound obtained by reacting (c) a polybasic acid anhydride with a product of a reaction between (a) an epoxy compound having two or more epoxy groups in the molecule and (b) a compound having one or more hydroxyl groups and one carboxyl group in the molecule.
Public/Granted literature
- US20170293225A1 PHOTOSENSITIVE RESIN COMPOSITION AND CURED PRODUCT THEREOF Public/Granted day:2017-10-12
Information query
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