An enclosure system with a temperature control system including an enclosure, a thermoelectric module having first and second portions, and a thermal controller. The enclosure includes a main body with an open end, a cover coupled to the open end of the main body, and an interior sized and configured to receive an electronic device therein, the interior defined by the main body and the cover. The enclosure further includes a sealing member provided at an interface between the main body and the cover such that the interface is substantially sealed and resistant to liquid ingress. The first portion is positioned within the interior. The second portion is coupled to or is otherwise in contact with a portion of the enclosure exposed to an external environment. The thermal controller is electrically coupled to the thermoelectric module and operable to control heating and/or cooling of a portion of the thermoelectric module.