Invention Grant
- Patent Title: Electroconductive film and method for manufacturing same
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Application No.: US15054968Application Date: 2016-02-26
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Publication No.: US10198132B2Publication Date: 2019-02-05
- Inventor: Akira Ichiki , Nozomu Tonoike
- Applicant: FUJIFILM Corporation
- Applicant Address: JP Tokyo
- Assignee: FUJIFILM Corporation
- Current Assignee: FUJIFILM Corporation
- Current Assignee Address: JP Tokyo
- Agency: Studebaker & Brackett PC
- Priority: JP2013-180644 20130830
- Main IPC: G06F3/044
- IPC: G06F3/044 ; G03F7/16 ; G03F7/20 ; G03F7/32 ; G06F3/047 ; G03F7/06

Abstract:
An electroconductive film and a method for manufacturing the electroconductive film, having an insulating substrate and an electrode including a thin metal wire disposed on the surface of the insulating substrate, wherein the width of the thin metal wire varies, the difference between the maximum wire width and the minimum wire width of the thin metal wire is 20% to less than 75% of the average wire width of the thin metal wire, and the average wire width is 1-7 μm.
Public/Granted literature
- US20160253002A1 ELECTROCONDUCTIVE FILM AND METHOD FOR MANUFACTURING SAME Public/Granted day:2016-09-01
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