Invention Grant
- Patent Title: Conductive resin composition and multilayer ceramic capacitor having the same
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Application No.: US14974784Application Date: 2015-12-18
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Publication No.: US10199133B2Publication Date: 2019-02-05
- Inventor: Sung Koo Kang , Myung Jun Park , Hyun Hee Gu , Kyung Pyo Hong , Chang Hoon Kim
- Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Applicant Address: KR Suwon-si, Gyeonggi-Do
- Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Current Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Current Assignee Address: KR Suwon-si, Gyeonggi-Do
- Agency: McDermott Will & Emery
- Priority: KR10-2012-0047293 20120504
- Main IPC: H01G4/008
- IPC: H01G4/008 ; H01G4/228 ; H01G4/232 ; C08L63/00 ; H01B1/22 ; C08K3/08 ; C08G59/42 ; C08G59/62 ; H01B1/24 ; H01G4/012 ; H01G4/12 ; H01G4/224 ; H01G4/30 ; C08K9/02
Abstract:
There is provided a conductive resin composition including epoxy resin, copper powder particles, and non-nitrogen-based hardeners.
Public/Granted literature
- US20160104552A1 CONDUCTIVE RESIN COMPOSITION AND MULTILAYER CERAMIC CAPACITOR HAVING THE SAME Public/Granted day:2016-04-14
Information query
