Invention Grant
- Patent Title: Method for manufacturing bonded body and method for manufacturing power-module substrate
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Application No.: US14775819Application Date: 2014-03-17
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Publication No.: US10199237B2Publication Date: 2019-02-05
- Inventor: Nobuyuki Terasaki , Yoshiyuki Nagatomo
- Applicant: MITSUBISHI MATERIALS CORPORATION
- Applicant Address: JP Tokyo
- Assignee: MITSUBISHI MATERIALS CORPORATION
- Current Assignee: MITSUBISHI MATERIALS CORPORATION
- Current Assignee Address: JP Tokyo
- Agency: Locke Lord LLP
- Priority: JP2013-055517 20130318
- International Application: PCT/JP2014/057121 WO 20140317
- International Announcement: WO2014/148425 WO 20140925
- Main IPC: H01L21/48
- IPC: H01L21/48 ; H01L23/373 ; H01L23/473 ; C04B37/02
Abstract:
A method for manufacturing a power-module substrate includes a lamination step of laminating a ceramic member and a copper member through an active metal material and a filler metal having a melting point of 710° C. or lower, and a heating treatment step of heating the ceramic member and the copper member laminated together.
Public/Granted literature
- US20160013073A1 METHOD FOR MANUFACTURING BONDED BODY AND METHOD FOR MANUFACTURING POWER-MODULE SUBSTRATE Public/Granted day:2016-01-14
Information query
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