Invention Grant
- Patent Title: Gas supply device and substrate processing apparatus
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Application No.: US15852194Application Date: 2017-12-22
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Publication No.: US10199241B2Publication Date: 2019-02-05
- Inventor: Yohei Uchida
- Applicant: Tokyo Electron Limited
- Applicant Address: JP Tokyo
- Assignee: TOKYO ELECTRON LIMITED
- Current Assignee: TOKYO ELECTRON LIMITED
- Current Assignee Address: JP Tokyo
- Agency: Pearne & Gordon LLP
- Priority: JP2012-109798 20120511
- Main IPC: H01L21/67
- IPC: H01L21/67 ; C23C16/455 ; H01J37/32

Abstract:
A gas supply device of supplying a gas into a processing space from a gas supply source includes a facing plate that faces the processing space and includes multiple through holes; multiple gas distribution plates; and a cover plate. The facing plate, the gas distribution plates, and the cover plate are stacked in sequence. In a surface, which faces the facing plate, of the gas distribution plate closest to the facing plate, multiple gas diffusion spaces including a first gas diffusion space and a second gas diffusion space are formed, and in each of the gas distribution plates, a first gas supply path through which a processing gas or an additional gas is supplied into the first gas diffusion space and a second gas supply path through which the processing gas or the additional gas is supplied into the second gas diffusion space are formed.
Public/Granted literature
- US20180190519A1 GAS SUPPLY DEVICE AND SUBSTRATE PROCESSING APPARATUS Public/Granted day:2018-07-05
Information query
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