Invention Grant
- Patent Title: Semiconductor process
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Application No.: US15268630Application Date: 2016-09-18
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Publication No.: US10199277B2Publication Date: 2019-02-05
- Inventor: Chen-Kuo Chiang , Chun-Hsien Lin
- Applicant: UNITED MICROELECTRONICS CORP.
- Applicant Address: TW Hsin-Chu
- Assignee: UNITED MICROELECTRONICS CORP.
- Current Assignee: UNITED MICROELECTRONICS CORP.
- Current Assignee Address: TW Hsin-Chu
- Agent Winston Hsu
- Main IPC: H01L21/8232
- IPC: H01L21/8232 ; H01L21/8234 ; H01L29/49 ; H01L29/66 ; H01L29/78 ; H01L21/02 ; H01L29/423 ; H01L29/51 ; H01L27/092

Abstract:
A semiconductor structure includes a stacked metal oxide layer on a substrate, wherein the stacked metal oxide layer includes a first metal oxide layer, a second metal oxide layer, and a third metal oxide layer from top to bottom, and the energy bandgap of the second metal oxide layer is lower than the energy bandgap of the first metal oxide layer and that of the third metal oxide layer. The semiconductor structure includes a metal oxide layer on a substrate, wherein the energy bandgap of the metal oxide layer changes along a direction perpendicular to the surface of the substrate. The present invention also provides a semiconductor process forming said semiconductor structure.
Public/Granted literature
- US20170005007A1 SEMICONDUCTOR PROCESS Public/Granted day:2017-01-05
Information query
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