Invention Grant
- Patent Title: Inspection apparatus and method of manufacturing semiconductor device using the same
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Application No.: US15626302Application Date: 2017-06-19
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Publication No.: US10199282B2Publication Date: 2019-02-05
- Inventor: Sung-Won Park , Jeong-Su Ha , Sangbong Park , Kwang Soo Kim , Byeong Kyu Cha
- Applicant: Samsung Electronics Co., Ltd.
- Applicant Address: KR Gyeonggi-Do
- Assignee: Samsung Electronics Co., Ltd.
- Current Assignee: Samsung Electronics Co., Ltd.
- Current Assignee Address: KR Gyeonggi-Do
- Agency: Harness, Dickey & Pierce, P.L.C.
- Priority: KR10-2016-0156716 20161123
- Main IPC: H01L21/66
- IPC: H01L21/66 ; G01N21/95 ; G01N21/88 ; G06T7/00 ; H04N7/18

Abstract:
Disclosed are an inspection apparatus and a method of manufacturing a semiconductor device using the same. The inspection apparatus includes a stage configured to receive a substrate, an objective lens on the stage and configured to enlarge the substrate optically, an ocular lens on the objective lens and configured to form at its image plane an image of the substrate, and a plurality of sensors above the ocular lens and in the image plane of the ocular lens.
Public/Granted literature
- US20180144998A1 INSPECTION APPARATUS AND METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE USING THE SAME Public/Granted day:2018-05-24
Information query
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