Invention Grant
- Patent Title: Semiconductor device, semiconductor chip, and test method for semiconductor chip
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Application No.: US15497713Application Date: 2017-04-26
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Publication No.: US10199292B2Publication Date: 2019-02-05
- Inventor: Hideki Masai
- Applicant: LAPIS Semiconductor Co., Ltd.
- Applicant Address: JP Yokohama
- Assignee: LAPIS Semiconductor Co., Ltd.
- Current Assignee: LAPIS Semiconductor Co., Ltd.
- Current Assignee Address: JP Yokohama
- Agency: Rabin & Berdo, P.C.
- Priority: JP2016-090323 20160428
- Main IPC: H01L23/525
- IPC: H01L23/525 ; H01L21/66 ; G01R31/26 ; H01L23/522 ; H01L23/00
Abstract:
A semiconductor device includes a signal processing circuit configured to generate an output signal, an output pad, an output line connecting the signal processing circuit to the output pad, the output signal from the signal processing circuit being output from the output pad through the output line, a shorting pad formed in the output line, a switch connected between the shorting pad and the output pad, and configured to connect the signal processing circuit to the output pad when the switch is on, and disconnect the signal processing circuit from the output pad when the switch is off, and a wiring line connecting the shorting pad to the output pad.
Public/Granted literature
- US20170316990A1 SEMICONDUCTOR DEVICE, SEMICONDUCTOR CHIP, AND TEST METHOD FOR SEMICONDUCTOR CHIP Public/Granted day:2017-11-02
Information query
IPC分类:
