Invention Grant
- Patent Title: Methods of manufacturing a printed circuit module having a semiconductor device with a protective layer in place of a low-resistivity handle layer
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Application No.: US15387855Application Date: 2016-12-22
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Publication No.: US10199301B2Publication Date: 2019-02-05
- Inventor: Dirk Robert Walter Leipold , George Maxim , Julio C. Costa , Baker Scott
- Applicant: Qorvo US, Inc.
- Applicant Address: US NC Greensboro
- Assignee: Qorvo US, Inc.
- Current Assignee: Qorvo US, Inc.
- Current Assignee Address: US NC Greensboro
- Agency: Withrow & Terranova, P.L.L.C.
- Main IPC: H01L23/31
- IPC: H01L23/31 ; H01L21/304 ; H01L21/02 ; H01L21/683 ; H01L23/29 ; H01L23/373 ; H01L23/00 ; H05K1/02 ; H05K1/18 ; H01Q1/50 ; H01L23/36 ; H01L21/56 ; H01L23/20 ; H01L23/367 ; H01L21/306 ; H01L23/522 ; H01L49/02
Abstract:
A printed circuit module having a protective layer in place of a low-resistivity handle layer and methods for manufacturing the same are disclosed. The printed circuit module includes a printed circuit substrate with a thinned integrated passive die (IPD) attached to the printed circuit substrate. A protective layer is disposed over the thinned IPD to protect passive devices integrated within the thinned IPD, wherein the protective layer has a thermal conductivity greater than 2 watts per meter Kelvin (W/mK) and an electrical resistivity of greater than 103 Ohm-cm.
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Information query
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